The 2nd Rapperswil International Bonding Forum will take place on the campus of the OST, Eastern Switzerland University of Applied Sciences, in Rapperswil, Switzerland, on 16 and 17 June 2022.
The conference focuses on Bonding Technology and especially on the topics of joint design for industrial applications, mechanical properties of adhesive joints, adhesion and surface treatments, quality procedures and standardisation.
The conference is chaired by Pierre Jousset, Professor at the OST, and Head of Joining Technologies at the IWK, Institute for Materials Technology and Plastics Processing.
Rapperswil is located directly on the beautiful lake of Zürich and surrounded by scenic mountains. Numerous train connections are available to reach Rapperswil from Zürich central station and international airport in approximately 60 minutes.
This two-day conference has been planned with the aim to bring together engineers and researchers from the industry, engineering schools and universities, to exchange about the state of the art and the latest innovations in the field of bonding technology. The contents of the conference focuses on applied research and industrial applications.